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如何利用MEMS计时技术优化平板电脑和其他便携设备的设计 技术白皮书...

CMOS back-end-of-line (BEOL) compatible MEMS resonators were fabricated via a low-temperature process flow. The flexural-mode resonator beams are made of a bi-layer consisting of a thin TaN and thick SiON film....

This paper will define a six-axis motion processing solution and examine critical factors involved in the selection and integration of this technology into everyday consumer electronic systems. Assuring compliance of the four critical factors outlined in this article will lead to higher integration efficiency when implementing new designs with six-axis motion processing, resulting in excellent performance in the end user device....

This paper discusses the usage of common sensor types and how sensors can be effectively combined in a complementary fashion. It introduces the state-ofthe-art InvenSense™ MotionProcessing™ technology through the integration of gyros from InvenSense and a reference design that enables developers to create advanced electronic devices incorporating with up to nine axes of motion....

This paper presents novel applications of MotionProcessing technology in existing consumer devices, and presents ideas for further development, to give the reader ideas of how they can use motion in their next product development....

ADI应用笔记 用数字控制优化MEMS陀螺仪的性能...

本应用笔记介绍一种由橡胶、硅橡胶等软材料制成的密封 ， 以 防 止 底 部 收 音 孔PCB安 装 麦 克 风 被 灰 尘 和 液 体 侵入。所述方案对性能的不利影响少，同时实现防水系统设计。...

布橹尔科技为MEMS生产提供一系列有机材料以及配套的工艺技术...

Optical image stabilization (OIS) in a camera phone poses unique challenges requiring both innovative technology and fresh thinking in a different league from digital still cameras to address performance, size, robustness and cost considerations. ...

The 3-axis MEMS accelerometer is also used to control many games, power management and shake modes to control music shuffle, undo, pedometers and a host of context-aware apps....

A Critical Review of the Market Status and Industry Challenges of Producing Consumer Grade MEMS Gyroscopes...

The Advantages of Integrated Passives...

Characterization of a 10 um_min chlorine-based ICP etch process for GaAs vias...

技术文件：Notch Reduction in Silicon on Insulator...

Wireless MEMS Sensor Platform Compatible with Cell Phones and Laptop...

Microelectrical-mechanical systems (MEMS) devices have experienced impressive and steady growth as they are integrated into people’s everyday lives. Since their conceptualization in the 1970’s, they have progressed from laboratory curiosity to integration in high-end systems, and, more recently, to widespread application in popular consumer devices....

Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of TSVs (through silicon vias) is used for 3D IC stacking of individual layers as well as in 3D packaging operations. A primary differentiator is the via size and therefore the placement accuracy needed to obtain production yields. ...